PCB Design

Dear Customer ,

When you need to entrust ICS for a PCB design , a set of complete and accurate information can significantly improve efficiency and reduce revisions. Below is a categorized list of key details to prepare:

1. Core Design Requirements

Functional Requirements

Product application (e.g., consumer electronics, industrial control, medical devices)

Key functional modules (e.g., power management, signal processing, wireless communication)

Special certifications needed (e.g., UL, CE, IPC standards)

Electrical Parameters

Operating voltage/current range

Signal types (high-frequency, high-speed digital, analog signals, etc.)

Impedance control requirements (e.g., 50Ω RF lines, differential pair impedance)

Noise sensitivity or EMC/EMI requirements

2. Hardware Design Inputs

Schematic & BOM

Complete schematic (PDF or source files in tools like Altium, KiCad, etc.)

Bill of Materials (BOM) with critical components (MCUs, sensors, interface ICs, etc.)

Component packaging requirements (if special packages or thermal considerations exist)

Reference Designs

Reference circuits or design files from similar projects (if available)

Evaluation board materials from chip manufacturers (e.g., layout guidelines)

3. PCB Physical Parameters

Mechanical Structure

Outline dimensions (DXF/DWG files or PDF with annotations)

Mounting hole positions, board thickness, and layer count (e.g., 4-layer, 6-layer, 8-layer , 10-layer or more)

Board edge constraints (keep-out zones, cutouts, panelization requirements)

Flex/rigid-flex PCB requirements (if applicable)

Stackup & Material

Substrate type (FR4, high-frequency materials like Rogers, aluminum core, etc.)

Layer stackup (thickness per layer, copper weight, dielectric constant requirements)

4. Interface & Layout Constraints

Connectors & Interfaces

All external interface types (USB, HDMI, power jacks, etc.) and placement requirements

Cable routing directions (e.g., avoiding interference with enclosures)

Critical Component Placement

Thermal management for heat-generating components (CPUs, power devices)

Isolation requirements for sensitive components (crystals, antennas)

High-voltage/low-voltage isolation needs

5. Manufacturing & Testing Requirements

Fabrication Process

Surface finish (ENIG, HASL, immersion gold, etc.)

Special processes (blind/buried vias, impedance control, solder mask openings)

Testing Requirements

Test point locations (e.g., for ICT testing)

Functional test needs (programming interfaces, self-test circuits)

6. Additional Information

Deliverables

Expected output files (Gerber, assembly drawings, 3D models, etc.)

Whether PCB fabrication or assembly (PCBA) support is needed

Project Timeline & Budget

Expected milestones (e.g., prototype delivery date)

Cost sensitivity (e.g., preference for low-cost solutions)

Checklist Example (For Client Quick Reference)

- [   ]  Schematic (PDF/source files)  

- [   ]  BOM (including critical component part numbers)  

- [   ]  Mechanical outline (DXF/DWG)  

- [   ]  Layer count & stackup requirements  

- [   ]  Interface types & positions  

- [   ]  Special signal/power requirements  

- [   ]  Manufacturing & testing needs  

By providing the above information,ICS company can efficiently deliver a solution that meets your needs. If any details are unclear, it’s recommended to clarify with ICS  in advance to avoid rework.